Exclusive

Publication

Byline

Location

US Patent Issued to Skyworks Solutions on July 28 for "Piston mode generation in thin plate lamb wave device" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,688, issued on July 28, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Piston mode generation in thin plate lamb wave device" w... Read More


US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on July 28 for "Process for manufacturing a phase change material with a crystallographic structure of layers separated by van der Waals pseudo-gaps" (French Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,689, issued on July 28, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Process for manufacturing ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Resistive memory device with enhanced local electric field and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,690, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Resistive memory device with enhanc... Read More


US Patent Issued to TetraMem on July 28 for "Resistive random-access memory (RRAM) devices with interface layers" (California, Massachusetts Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,691, issued on July 28, was assigned to TetraMem Inc. (San Jose, Calif.). "Resistive random-access memory (RRAM) devices with interface lay... Read More


US Patent Issued to II-VI Advanced Materials on July 28 for "Crystalline wafers and process for forming crystalline wafers" (Delaware Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,692, issued on July 28, was assigned to II-VI Advanced Materials LLC (Pine Brook, N.J.). "Crystalline wafers and process for forming crysta... Read More


US Patent Issued to STMicroelectronics on July 28 for "Manufacturing method of a SiC wafer with residual stress control" (Italian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,693, issued on July 28, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy). "Manufacturing method of a SiC wafer with residu... Read More


US Patent Issued to Sony Semiconductor Solutions on July 28 for "Imaging device and method of manufacturing imaging device" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,694, issued on July 28, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Imaging device and method of manufacturing i... Read More


US Patent Issued to Tokyo Electron on July 28 for "Atomic layer deposition of passivation layer" (American, Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,695, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Atomic layer deposition of passivation layer" was invented by Du Zhan... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Dielectric densification" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,696, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Dielectric densification" was i... Read More


US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, HAMAMATSU PHOTONICS on July 28 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,697, issued on July 28, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Ni... Read More